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DLA - DSCC-VID-V62/12623

MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 10 December 2012
Status: inactive
Page Count: 21
scope:

This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +85°C.

Document History

DSCC-VID-V62/12623 REV B
October 18, 2023
MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON
A description is not available for this item.
DSCC-VID-V62/12623 REV A
May 22, 2018
MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +85°C.
DSCC-VID-V62/12623
December 10, 2012
MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +85°C.

References

This document references:
JEP95 BOOK 1 - Book One Registered and Standard Outlines for Solid State and Related Products
Published by JEDEC on March 1, 1997
PREFACE This Publication contains those solid state product outlines and other associated drawings that have been registered and assigned a JEDEC designation and are printed on white paper. Product...
This document references:
JEDEC JESD 51-2 - Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
Published by JEDEC on January 1, 2008
This document outlines the environmental conditions necessary to ensure accuracy and repeatability for a standard junction-to-ambient thermal resistance measurement in natural convection.
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
This document references:
JEDEC JESD 51-8 - Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
Published by JEDEC on October 1, 1999
This specification should be used in conjunction with the overview document JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) [1] and the electrical...
This document references:
JEP95 BOOK 2 - Registered and Standard Outlines for Solid State and Related Products
Published by JEDEC on March 1, 1997
A description is not available for this item.
This document references:
J-STD-020F - Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published by JEDEC on December 1, 2022
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
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