DIN EN 62137-4
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 91/1056/CD:2012)
inactive
| Organization: | DIN |
| Publication Date: | 1 January 2013 |
| Status: | inactive |
| Page Count: | 73 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Electronic components in general): | 31.020 |
Document History
July 1, 2015
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
Dieser Teil der IEC 62137 legt das Prüfverfahren fest für die Lötverbindungen von auf Leiterplatten montierten Bauteilgehäusen mit Flächenmatrix zur Bewertung der Beständigkeit der Lötverbindungen...
DIN EN 62137-4
January 1, 2013
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 91/1056/CD:2012)
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