scope:

The purpose of this test method is to measure the shape and relative change in shape of a local area of interest (e.g., flip-chip ball grid array (FCBGA) land area) of printed boards through a range of temperatures typical during surface mount and through-hole builds of integrated circuit packages to printed boards. The use of shape measurements and relative changes in shape will depend on the specific application and interest of the user performing the measurement. This guideline differs from and does not supersede IPC-TM-650, Method 2.4.22, which is used for inspection of bow and/or twist of bare printed boards at room temperature.