IEC 62047-11
Semiconductor devices – Micro-electromechanical devices – Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
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| Organization: | IEC |
| Publication Date: | 1 July 2013 |
| Status: | active |
| Page Count: | 42 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
scope:
This part of IEC 62047 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric etc.) microelectro- mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 μm and 1 mm and thickness between 0,1 μm and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material's melting temperature.
Document History
IEC 62047-11
July 1, 2013
Semiconductor devices – Micro-electromechanical devices – Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
This part of IEC 62047 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric etc.) microelectro- mechanical...