DS/EN 62739-1
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
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| Organization: | DS |
| Publication Date: | 30 September 2013 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
Document History
DS/EN 62739-1
September 30, 2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath...
Test method for erosion of wave soldering equipment using molten lead-free solder alloy -- Part 1: Erosion test method for metal materials without surface processing
This part of IEC 62739 provides a evaluating test method for the erosion of the metallic materials without surface processing intended to use for lead-free wave soldering equipment as a solder bath...
Test method for erosion of wave soldering equipment using molten lead-free solder alloy -- Part 1: Erosion test method for metal materials without surface processing
This part of IEC 62739 provides a evaluating test method for the erosion of the metallic materials without surface processing intended to use for lead-free wave soldering equipment as a solder bath...