scope:

The present document applies to earthing and bonding of ICT equipment installed in data and telecom centres and similar installations operating within the normal service voltage range up to 400 VDC defined in EN 300 132-3-1 [1].

Earthing and bonding network of the building (CBN), the bonding network of the equipment (SRPP), and the interconnection between these two networks are treated in the present document. It contributes to the standardization of telecommunication and datacom equipment installation.

It also co-ordinates with the pre-conditions of the installation to achieve the following targets:

• safety from electrical hazards;

• continuity of service requiring:

- reliable signal reference;

- satisfactory Electromagnetic Compatibility (EMC) performance.

The present document defines earthing and bonding configuration down to the equipment level in order to facilitate the installation, operation and maintenance of data and telecom centres in data and telecom buildings or similar installations independent of the equipment supplier.

The specification of ICT equipment and of the pre-conditions of installation is subject to agreement of the parties (e.g. the supplier and the purchaser). Annex A can be used in the procedure to achieve an agreement.

The present document does not cover safety and EMC aspects of the equipment. Those aspects are covered by other relevant standards.

The present document applies to the installation of ICT equipment in data and telecom centres. The present document may also be applicable for ICT equipment in other locations, e.g.:

• street cabinet;
• container;
• subscriber's building;
• BTS.