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ASTM D1151

Standard Practice for Effect of Moisture and Temperature on Adhesive Bonds

active, Most Current
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Organization: ASTM
Publication Date: 10 March 2000
Status: active
Page Count: 3
ICS Code (Adhesives): 83.180
scope:

This practice defines conditions for determining the performance of adhesive bonds when subjected to continuous exposure at specified conditions of moisture and temperature. The performance is expressed as a percentage based on the ratio of strength retained after exposure to the original strength.

The values stated in SI units are to be regarded as the standard. The values given in parentheses are provided for information purposes only.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Document History

ASTM D1151
March 10, 2000
Standard Practice for Effect of Moisture and Temperature on Adhesive Bonds
This practice defines conditions for determining the performance of adhesive bonds when subjected to continuous exposure at specified conditions of moisture and temperature. The performance is...
March 10, 2000
Standard Practice for Effect of Moisture and Temperature on Adhesive Bonds
This practice defines conditions for determining the performance of adhesive bonds when subjected to continuous exposure at specified conditions of moisture and temperature. The performance is...
March 10, 2000
Standard Practice for Effect of Moisture and Temperature on Adhesive Bonds
1. Scope 1.1 This practice defines conditions for determining the performance of adhesive bonds when subjected to continuous exposure at specified conditions of moisture and temperature. The...
March 30, 1990
Standard Test Method for Effect of Moisture and Temperature on Adhesive Bonds
1. Scope 1.1 This test method defines conditions for determining the performance of adhesive bonds when subjected to continuous exposure at specified conditions of moisture and temperature. The...
February 24, 1984
STANDARD TEST METHOD FOR EFFECT OF MOISTURE AND TEMPERATURE ON ADHESIVE BONDS
A description is not available for this item.

References

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