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ASTM D1867

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

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Organization: ASTM
Publication Date: 1 November 2013
Status: active
Page Count: 5
ICS Code (Printed circuits and boards): 31.180
scope:

This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. 

The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. 

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

*A Summary of Changes section appears at the end of this standard

Document History

ASTM D1867
November 1, 2013
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed...
May 1, 2007
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed...
September 10, 2001
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed...
March 10, 1996
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
1. Scope 1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication...
October 15, 1994
STANDARD SPECIFICATION FOR COPPER-CLAD THERMOSETTING LAMINATES FOR PRINTED WIRING
A description is not available for this item.
June 15, 1993
STANDARD SPECIFICATION FOR COPPER-CLAD THERMOSETTING LAMINATES FOR PRINTED WIRING
A description is not available for this item.
February 15, 1992
STANDARD SPECIFICATION FOR COPPER-CLAD THERMOSETTING LAMINATES FOR PRINTED WIRING
A description is not available for this item.
May 15, 1991
STANDARD SPECIFICATION FOR COPPER-CLAD THERMOSETTING LAMINATES FOR PRINTED WIRING
A description is not available for this item.
August 31, 1990
STANDARD SPECIFICATION FOR COPPER-CLAD THERMOSETTING LAMINATES FOR PRINTED WIRING
A description is not available for this item.
March 8, 1988
STANDARD SPECIFICATION FOR COPPER-CLAD THERMOSETTING LAMINATES FOR PRINTED WIRING
A description is not available for this item.
July 30, 1982
STANDARD SPECIFICATION FOR COPPER-CLAD THERMOSETTING LAMINATES FOR PRINTED WIRING
A description is not available for this item.

References

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