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TIA/EIA-455-4

FOTP-4 Fiber Optic Component Temperature Life Test

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Organization: TIA
Publication Date: 1 June 2002
Status: active
Page Count: 24
scope:

Introduction

Intent

The intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature for a specific length of time.1 The procedure is applicable to all types of fiber optic devices including connectors, splices, passive branching devices (couplers), etc.

Failure Modes

Potential failure modes for this test include, but are not limited to:

a. Loss of optical continuity, either during or at the end of the test,

b. Fiber breakage or damage,

c. Breakage of other components,

d. Loss of component integrity,

e. Degradation of optical transmission and/or reflection characteristics.

Document History

TIA/EIA-455-4
June 1, 2002
FOTP-4 Fiber Optic Component Temperature Life Test
Introduction Intent The intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature...
June 1, 2002
FOTP-4 Fiber Optic Component Temperature Life Test
The intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature for a specific length of...
September 1, 1993
FOTP-4 Fiber Optic Component Temperature Life Test
A description is not available for this item.

References

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