TIA/EIA-455-4
FOTP-4 Fiber Optic Component Temperature Life Test
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| Organization: | TIA |
| Publication Date: | 1 June 2002 |
| Status: | inactive |
| Page Count: | 22 |
scope:
The intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature for a specific length of time.(Footnote 1) The procedure is applicable to all types of fiber optic devices including connectors, splices, passive branching devices (couplers), etc.
Footnote 1 - This method is similar to method 1005.1 of MIL-STD-1344A, except that this procedure includes supplementary measurements.
Document History
June 1, 2002
FOTP-4 Fiber Optic Component Temperature Life Test
Introduction
Intent
The intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature...
TIA/EIA-455-4
June 1, 2002
FOTP-4 Fiber Optic Component Temperature Life Test
The intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature for a specific length of...
September 1, 1993
FOTP-4 Fiber Optic Component Temperature Life Test
A description is not available for this item.