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DLA - DSCC-VID-V62/14602

MICROCIRCUIT, LINEAR, HIGH INPUT VOLTAGE BUCK BOOST CONVERTER WITH 2 AMP SWITCH CURRENT, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 4 March 2014
Status: inactive
Page Count: 11
scope:

This drawing documents the general requirements of a high performance high input voltage buck boost converter with 2 amp switch current microcircuit, with an operating temperature range of -55°C to +125°C.

Document History

DSCC-VID-V62/14602 REV A
February 4, 2020
MICROCIRCUIT, LINEAR, HIGH INPUT VOLTAGE BUCK BOOST CONVERTER WITH 2 AMP SWITCH CURRENT, MONOLITHIC SILICON
Scope. This drawing documents the general requirements of a high performance high input voltage buck boost converter with 2 amp switch current microcircuit, with an operating temperature range of...
DSCC-VID-V62/14602
March 4, 2014
MICROCIRCUIT, LINEAR, HIGH INPUT VOLTAGE BUCK BOOST CONVERTER WITH 2 AMP SWITCH CURRENT, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance high input voltage buck boost converter with 2 amp switch current microcircuit, with an operating temperature range of -55°C to...

References

This document references:
JEDEC JESD 51-2 - Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
Published by JEDEC on January 1, 2008
This document outlines the environmental conditions necessary to ensure accuracy and repeatability for a standard junction-to-ambient thermal resistance measurement in natural convection.
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
This document references:
JEDEC JESD 51-8 - Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
Published by JEDEC on October 1, 1999
This specification should be used in conjunction with the overview document JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) [1] and the electrical...
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