scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 EL2002A Low power buffer amplifier 02 EL2002 Low power buffer amplifier

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Total supply voltage (+V_S to −V_S) . . . . . . . . . . . . 36 V dc Supply voltage (V_S) . . . . . . . . . . . . . . . . . . . ±18 V dc Input voltage (V_IN) 1/ . . . . . . . . . . . . . . . . . ±15 V dc or V_S Input current (I_IN) 1/ . . . . . . . . . . . . . . . . . ±50 mA Output short circuit duration 2/ . . . . . . . . . . . . Continuous Junction temperature (T_J) . . . . . . . . . . . . . . . . +175°C Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds). . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) 3/ . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA): 3/ Case P . . . . . . . . . . . . . . . . . . . . . . . +125°C/W Case 2 . . . . . . . . . . . . . . . . . . . . . . . +100°C/W

Supply voltage (V_S) . . . . . . . . . . . . . . . . . . . . ±15 V dc Ambient operating temperature range (T_A) . . . . . . . . . −55°C to +125°C

intended Use: