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IPC/WHMA-A-620 FRENCH

Requirements and Acceptance for Cable and Wire Harness Assemblies

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Organization: IPC
Publication Date: 1 July 2006
Status: inactive
Page Count: 409

Document History

IPC/WHMA-A-620 FRENCH
January 1, 2020
Requirements and acceptance of cable and cable assemblies wire bundles
A description is not available for this item.
IPC/WHMA-A-620 FRENCH
January 1, 2017
Requirements and Acceptance for Cable and Wire Harness Assemblies
A description is not available for this item.
IPC/WHMA-A-620 FRENCH
July 1, 2006
Requirements and Acceptance for Cable and Wire Harness Assemblies
Cette norme est un catalogue de critères visuels, électriques et mécaniques d'acceptation pour l'assemblage des câbles et des faisceaux de câbles. Il a été élaboré par l'ITGC, le Comité aux...
IPC/WHMA-A-620 FRENCH
July 1, 2006
Requirements and Acceptance for Cable and Wire Harness Assemblies
A description is not available for this item.

References

This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation. This document presents...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC/ECA J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Published by IPC on January 1, 1992
A description is not available for this item.
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
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