scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 21062L 3.3-V digital signal processor, 32-bit, 2 Mbit SRAM 02 21060L 3.3-V digital signal processor, 32-bit, 4 Mbit SRAM

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 240 Gull wing flatpack cavity down heat sink Y See figure 1 240 Gull wing flatpack cavity up heat sink T See figure 1 240 Flatpack with non-conductive tie-bar cavity down heat sink U See figure 1 240 Flatpack with non-conductive tie-bar cavity up heat sink

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_DD) .................... −0.3 V dc to +4.6 V dc Input voltage range (V_IN) ..................... −0.3 V dc to V_DD + 0.3 V dc Output voltage range (V_OUT) ................... −0.3 V dc to V_DD + 0.3 V dc Load capacitance .............................. 200 pF Lead temperature (soldering, 5 seconds) ....... +280°C Storage temperature range (T_STG) .............. −65°C to + 150°C Maximum power dissipation (P_D) ................ 5 W Thermal resistance junction-to-case (Θ_JC): Cases X, Y, T, and U ........................ 0.24°C/W

Supply voltage range (V_DD) .................... +3.13 V dc to +3.47 V dc Case operating temperature range (T_C) ......... −55°C to + 125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012).. XX percent 2/

intended Use: