IPC-4103
Specification for Base Materials for High Speed/High Frequency Applications
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| Organization: | IPC |
| Publication Date: | 1 January 2002 |
| Status: | inactive |
| Page Count: | 52 |
scope:
This specification covers the requirements for high speed/high frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or multilayer printed boards for high speed/high frequency electrical and electronic circuits. This specification applies to material thickness defined in the specification sheets as measured over the dielectric only.
Document History
November 1, 2017
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
November 1, 2015
Specification for Base Materials for High Speed/High Frequency Applications
A description is not available for this item.
January 1, 2014
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
December 1, 2011
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
January 1, 2002
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or...