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IPC-4103

Specification for Base Materials for High Speed/High Frequency Applications

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Organization: IPC
Publication Date: 1 November 2015
Status: inactive
Page Count: 7

Document History

IPC-4103
November 1, 2017
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
November 1, 2015
Specification for Base Materials for High Speed/High Frequency Applications
A description is not available for this item.
IPC-4103
January 1, 2014
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
December 1, 2011
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
January 1, 2002
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or...

References

This document references:
IPC-QL-653 - Certification of Facilities That Inspect/Test Printed Boards, Components and Materials
Published by IPC on November 1, 1997
This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum...
This document references:
IPC-SG-141 - Specification for Finished Fabric Woven from "S" Glass for Printed Boards
Published by IPC on February 1, 1992
This specification covers finished fabrics woven from "S" Glass Electrical Grade Glass Fiber, yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use.
This document references:
TM-650 2.1.5A - Surface Examination, Unclad and Metal Clad Material
Published by IPC on December 1, 1982
This test method identifies the major areas of concern during a visual examination and describes the recommended procedures.
This document references:
J-STD-003 - Solderability Tests for Printed Boards
Published by IPC on April 1, 2014
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document is referenced by:
IPC-2141 - Design Guide for High-Speed Controlled Impedance Circuit Boards
Published by IPC on March 1, 2004
This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each other’s area. The...
This document is referenced by:
IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits
Published by IPC on November 1, 2003
The goal in electronic packaging is to transfer a signal from one device to one or more other devices through a conductor. Considerations include electrical noise, electromagnetic interference,...
This document is referenced by:
IPC-6018 - Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Published by IPC on July 1, 2016
Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline...
This document is referenced by:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document is referenced by:
IEC PAS 61182-12 - Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Published by IEC on August 1, 2014
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling,...
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