scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Address access time 01 V750 22-input 10-output and-or-logic array 35 ns 02 V750 22-input 10-output and-or-logic array 25 ns 03 V750 22-input 10-output and-or-logic array 20 ns 04 V750L 22-input 10-output and-or-logic array 30 ns 05 V750L 22-input 10-output and-or-logic array 25 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outlines shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24, CDIP4-T24 24 dual-in-line package 3 CQCCI-N28 28 square chip carrier package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range- - - - - - - - - - - - - - - - −2.0 V dc to +7.0 V dc 2/ Output voltage applied - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc 2/ Output sink current- - - - - - - - - - - - - - - - 16 mA Thermal resistance, junction-to-case (Θ_JC) - - - - See MIL-STD-1835 Maximum power dissipation (P_D) 3/ - - - - - - - - 1.2 W Maximum junction temperature - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds maximum) - +300°C Data retention - - - - - - - - - - - - - - - - - - 20 years (minimum)

Supply voltage (V_CC) - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage (V_IH) - - - - - - - - - - 2.0 V dc minimum Low level input voltage (V_IL)- - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (T_C)- - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012)- - - - - 4/ percent

intended Use: