scope:

This drawing documents three product assurance class levels consisting of space application (device class V), high reliability (device classes M and Q), and nontraditional performance environment (device class N). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class N, the user is cautioned to assure that the device is appropriate for the application environment.

The PIN is as shown in the following example:

Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function Temperature Range Speed 01 80502 32-bit Microprocessor −55°C to +125°C 50/100 MHz 02 80502 32-bit Microprocessor −40°C to +110°C 50/100 MHz 03 80502 32-bit Microprocessor −40°C to +85°C 50/100 MHz 04 80502 32-bit Microprocessor −55°C to +125°C 60/120 MHz 05 80502 32-bit Microprocessor −40°C to +110°C 60/120 MHz 06 80502 32-bit Microprocessor −40°C to +85°C 60/120 MHz 07 80502 32-bit Microprocessor −55°C to +125°C 66/133 MHz 08 80502 32-bit Microprocessor −40°C to +110°C 66/133 MHz 09 80502 32-bit Microprocessor −40°C to +85°C 66/133 MHz

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A N Certification and qualification to MIL-PRF-38535 with a nontraditional performance environment 1/ Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figures 1 296 Staggered Pin Grid Array

The lead finish is as specified in MIL-PRF-38535 for device classes N, Q, and V or MIL-PRF-38535, appendix A for device class M.

Storage Temperature Range .................................... −65°C to +150°C Case Temperature Under Bias .................................. −65°C to +125°C 3 V Supply Voltage with respect to Ground .................... −0.5 V dc to +4.1 V dc 3 V Only Buffer Input Voltage with respect to Ground ......... −0.5 V dc to Vcc + 0.5 V dc (not to exceed 4.6 V) 5V Safe Buffer Input Voltage with respect to Ground .......... −0.5 V dc to 6.5 V dc Lead Temperature (soldering 10 seconds) ...................... 300°C Thermal Resistance, Junction-to-case (θ_JC): Case X ...... 1.7°C/W 3/ Thermal Resistance, Junction-to-ambient (θ_JA): Case X ... 16.2°C/W 3/ 4/

Case Operating Temperature Range device type 01, 04 and 07 .................................. −55°C to +125°C device type 02, 05 and 08 .................................. −40°C to +110°C device type 03, 06 and 09 .................................. −40°C to +85°C Supply Voltage, V_CC3 ......................................... 3.135 V dc < V_CC < 3.465 V dc Supply Voltage, V_CC2 ......................................... 2.935 V dc < V_CC < 3.265 V dc

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ................. 97.6 percent

intended Use: