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IPC - TM-650 2.6.4B

Outgassing, Printed Boards

active, Most Current
Organization: IPC
Publication Date: 1 May 2004
Status: active
Page Count: 2
scope:

This test method is used to determine the total mass loss (TML) and collected volatile condensable material (CVCM) of materials when exposed to a heated vacuum environment. Mass loss may be due to outgassing of low molecular weight materials present in printed boards such as trapped plating solutions, improper lamination, and uncured adhesives which are known to cause contamination or corrosion of spacecraft equipment.

Document History

TM-650 2.6.4B
May 1, 2004
Outgassing, Printed Boards
This test method is used to determine the total mass loss (TML) and collected volatile condensable material (CVCM) of materials when exposed to a heated vacuum environment. Mass loss may be due to...
August 1, 1997
Outgassing, Printed Boards
A description is not available for this item.
July 1, 1984
Outgassing Multilayer Printed Wiring Boards
A description is not available for this item.

References

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