IPC - TM-650 2.6.4B
Outgassing, Printed Boards
|Publication Date:||1 May 2004|
This test method is used to determine the total mass loss (TML) and collected volatile condensable material (CVCM) of materials when exposed to a heated vacuum environment. Mass loss may be due to outgassing of low molecular weight materials present in printed boards such as trapped plating solutions, improper lamination, and uncured adhesives which are known to cause contamination or corrosion of spacecraft equipment.