UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.6.4

Outgassing Multilayer Printed Wiring Boards

inactive
Organization: IPC
Publication Date: 1 July 1984
Status: inactive
Page Count: 1

Document History

TM-650 2.6.4B
May 1, 2004
Outgassing, Printed Boards
This test method is used to determine the total mass loss (TML) and collected volatile condensable material (CVCM) of materials when exposed to a heated vacuum environment. Mass loss may be due to...
TM-650 2.6.4A
August 1, 1997
Outgassing, Printed Boards
A description is not available for this item.
TM-650 2.6.4
July 1, 1984
Outgassing Multilayer Printed Wiring Boards
A description is not available for this item.

References

This document references:
E595 - Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment
May 1, 2015
This test method covers a screening technique to determine volatile content of materials when exposed to a vacuum environment. Two parameters are measured: total mass loss (TML) and collected...
Advertisement