scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54F109 Dual J- K positive edge triggered flip flops with clear and preset

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)....................................−0.5 V to +7.0 V Input voltage range (V_IN).....................................−1.2 V to +7.0 V 2/ Input current range (I_IN).....................................−30 mA and +5 mA Voltage range applied to any output in the high state.........−0.5 V to V_CC Current into any output in the low state......................40 mA Maximum power dissipation (P_D)................................94 mW Junction temperature (T_J).....................................+175°C Storage temperature range.....................................−65°C to + 150°C Thermal resistance, junction-to-case (Θ_JC): Case E......................................................28°C/W Case F......................................................22°C/W Case 2......................................................20°C/W Thermal resistance, junction-to-ambient (_JA): Case E......................................................90°C/W Case F......................................................165°C/W Case 2......................................................65°C/W

Supply voltage range (V_CC)....................................4.5 V to 5.5 V High-level input voltage (V_IH)................................2 V Low-level input voltage (V_IL).................................0.8 V Input clamp current (I_IK).....................................−18 mA High-level output current (I_OH)...............................−1 mA Low-level output current (I_OL)................................20 mA Case operating free-air temperature (T_C)......................−55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012).............................XX percent 3/

intended Use: