scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54AS74A Dual positive-edge-triggered D-type flip-flops w/clear and preset

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 2 CQCC1-N20 20 Square chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V_CC) .............................................. +7.0 V dc Maximum power dissipation (P_D) 2/ ................................. 112 mW Input voltage (V_I) ................................................ +7.0 V dc Storage temperature range ......................................... −65°C to +150°C Thermal resistance, junction-to-case (Θ_JC) ......................... See MIL-STD-1835 Junction temperature (T_J) ......................................... +175°C Case operating temperature range (T_C) ............................. −55°C to +125°C

Supply voltage range (V_CC) ........................................ +4.5 V dc to +5.5 V dc High-level input voltage (V_IH) .................................... +2.0 V minimum Low-level input voltage (V_IL) ..................................... +0.8 V maximum High-level output current (I_OH) ................................... −2.0 mA maximum Low-level output current (I_OL) .................................... 20 mA maximum Clock Frequency (f_clock) .......................................... 0-90 MHz Pulse duration (t_w): [P bar][R bar][E bar] or [C bar][L bar][R bar] low .................................................. 4 ns minimum CLK high ........................................................ 4 ns minimum CLK low ......................................................... 5.5 ns minimum Setup time before CLK↑ (t_su): Data: ........................................................... 4.5 ns minimum [P bar][R bar][E bar] or [C bar][L bar][R bar] inactive: ............................................ 2 ns minimum Hold time after CLK↑ (t_h) Data ................................... 0 ns minimum Case operating temperature (T_C) ................................... −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ..................... XX percent 3/

intended Use: