scope:

This document provides guidelines for the preparation of components for assembly to printed wiring boards, and contains a review of some pertinent design cri- teria, impacts and issues, techniques for assembly (both manual and machines) as well as consideration of, and impacts upon, subsequent soldering, cleaning, and coating processes. The information herein consists of compiled data representing commercial, industrial, and military applications.

This "Guideline" has been organized in a manner which is intended to simplify finding information relating to specific component types in the earlier sections and general process information in the later sections of the document. However, because of the rapid progress and evolution in packaging and assembly technology, all currently available components or assembly techniques may not be covered in this document.