scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 HS508RH Radiation hardened DI single 8-channel MUX/DEMUX 02 HS509RH Radiation hardened DI differential 4-channel MUX/DEMUX

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outltine(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E CDIP1-T16 16 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage between +V and −V - - - - - - - - - - - - - - - - - - +44 V Supply voltage between +V and ground - - - - - - - - - - - - - - - - - +22 V Supply voltage between −V and ground - - - - - - - - - - - - - - - - - −22 V Digital input voltage range +V_EN, +V_A - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +V_SUPPLY + 4 V −V_EN, −V_A - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −V_SUPPLY − 4 V Analog input overvoltage +V_S - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +V_SUPPLY + 2 V −V_S - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −V_SUPPLY − 2 V Peak current, S or D (pulsed at 1 ms, 10 percent duty cycle max) - - - - - - - - - - - - - 40 mA Storage temperature range - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum package power dissipation at T_A = +125°C (P_D)- - - - - - - - - 0.55 W 2/ Thermal resistance, junction-to-case (Θ_JC) - - - - - - - - - - - - - - 28°C/W Thermal resistance, junction-to-ambient (Θ_JA) - - - - - - - - - - - - 90°C/W Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - - - +175°C

Operating supply voltage (±V_SUPPLY) - - - - - - - - - - - - - - - - - ±15 V Analog input voltage (V_S)- - - - - - - - - - - - - - - - - - - - - - - ±V_SUPPLY Logic low level (V_AL) - - - - - - - - - - - - - - - - - - - - - - - - 0 V to 0.8 V Logic high level (V_AH) - - - - - - - - - - - - - - - - - - - - - - - - +2.4 V to +V_SUPPLY Max RMS current, S or D - - - - - - - - - - - - - - - - - - - - - - - 8 mA Ambient operating temperature range (T_A) - - - - - - - - - - - - - - - −55°C to +125°C Radiation features: Dose rate upset (20 ns pulse) - - - - - - - - - - - - - - - - - - - 3/ Total dose - - - - - - - - - - - - - - - - - - - - - - - - - - - - - > 10 Krads(Si) Latch-up 4/ - - - - - - - - - - - - - - - - - - - - - - - - - - - - None

intended Use: