Time, Temperature and Humidity Stress of Final Board Finish Solderability
|Publication Date:||1 May 2006|
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust finish will fail. The stress test need not duplicate real world environment (fabrication through assembly), but it must correlate to solderability performance.