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IPC-TR-585

Time, Temperature and Humidity Stress of Final Board Finish Solderability

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Organization: IPC
Publication Date: 1 May 2006
Status: active
Page Count: 64
scope:

PURPOSE

The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust finish will fail. The stress test need not duplicate real world environment (fabrication through assembly), but it must correlate to solderability performance.

Document History

IPC-TR-585
May 1, 2006
Time, Temperature and Humidity Stress of Final Board Finish Solderability
PURPOSE The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non...

References

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