scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 68902A 33 MHz enhanced multi-function peripheral

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style Z CMGA3-P121 68 Pin grid array Y See figure 1 68 Gullwing-Lead chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_DD) . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc Input voltage range (V_IN) . . . . . . . . . . . . . . . . . . . . . . . −1.5 V dc to V_DD +1.5 V dc Output voltage range (V_OUT) . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to V_DD +0.5 V dc DC current drain per pin; any single input or output . . . . . . . . . . . . . . . . . . . . . 50 mA DC current drain per pin; any single parallel outputs . . . . . . . . . . . . . . . . . . . . . 100 mA DC current drain; V_DD and V_SS . . . . . . . . . . . . . . . . . . . . . . . . . 75 mA Storage temperature range (T_STG) . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . +300°C Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . . . . +175°C Power dissipation (P_D) . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W Thermal resistance, junction-to-case (θ_JC case Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 case Y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 °C/W

Supply voltage range (V_DD) . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc Input voltage (V_IN) . . . . . . . . . . . . . . . . . . . . . . . . . . −1.5 V dc to V_DD +1.5 V dc Output voltage (V_OUT) . . . . . . . . . . . . . . . . . . . . . . . . . −1.5 V dc to V_DD +1.5 V dc Case operating temperature range (T_C) . . . . . . . . . . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . XX percent 3/

intended Use: