scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and H) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Devices classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 MAX532A Dual serial-input, voltage-output, 12-bit multiplying digital-to-analog converter 02 MAX532B Dual serial-input, voltage-output, 12-bit multiplying digital-to-analog converter

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883. Q or V Certification and qualification to MIL-I-38535.

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications then lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_DD to D_GND, A_GNDA, A_GNDB .......................... −0.3 V, +17 V V_SS to D_GND, A_GNDA, A_GNDB .......................... +0.3 V, −17 V V_REFA, V_REFB ....................................... (V_SS − 0.3 V) to (V_DD + 0.3 V) A_GNDA, A_GNDB ....................................... (D_GND − 0.3 V) to (V_DD + 0.3 V) V_OUTA, V_OUTB ....................................... (V_SS − 0.3 V) to (V_DD + 0.3 V) R_FBA, R_FBB ......................................... (V_SS − 0.3 V) to (V_DD + 0.3 V) S_CLK, D_IN, D_OUT, [L bar][D bar][A bar][C bar], [C bar][S bar] ......................... (D_GND − 0.3 V) to (V_DD + 0.3 V) D_OUT sink current .................................. 20 mA Junction temperature (T_j) .......................... +150°C Storage temperature range .......................... −65°C to +160°C Lead temperature (soldering, 10 seconds) ........... 300°C Continuous power dissipation, T_A = 70°C (P_D): Derate linearly 10.0 mW/°C above +70°C ........... 800 mW Thermal resistance, junction-to-case (θ_JC): ........ 50°C/W Thermal resistance, junction-to-ambient (θ_JA): ..... 100°C/W

Ambient operating temperature range (T_A) ........ −55°C to +125°C

intended Use: