scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 7524 COMS 8-bit multiplying buffered DAC with .5 LSB 02 7524 CMOS 8-bit multiplying buffered DAC with .25 LSB 03 7524 CMOS 8-bit multiplying buffered DAC with .125 LSB

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

V_DD to GND - - - - - - - - - - - - - - - - - - - - - −.3 V, +17 V V_RFB to GND- - - - - - - - - - - - - - - - - - - - - ±25 V Digital input voltage to GND - - - - - - - - - - - - −0.3 V to V_DD V_REF to GND- - - - - - - - - - - - - - - - - - - - - ±25 V V_OUT1, V_OUT2, 0 to GND - - - - - - - - - - - - - - - −0.3 V to V_DD Power dissipation (P_D): Up to ±75°C- - - - - - - - - - - - - - - - - - - - 450 mW Derates above +75°C- - - - - - - - - - - - - - - - 6 mW/°C Storage temperature range- - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - - - See MIL-M-38510, appendix C Thermal resistance, junction-to-ambient (θ_JA)- - - - 120°C/W

Ambient operating temperature range (T_A) - - - - - - −55°C to +125°C Supply voltage range (V_DD) - - - - - - - - - - - - - +5 V to +15 V

intended Use: