scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following examples.

For device classes M and Q:

For device class V:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 DS16F95 RS-485 differential bus transceiver

The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Leadless chip carrier H GDFP1-F10 or CDFP2-F10 10 Flat Pack X See figure 1 10 Flat Pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V_CC)................................ +7.0 V dc Differential input voltage ......................... −10 V/+15 V dc Enable input voltage................................ 5.5V dc Lead temperature: Case P (soldering, 60 seconds) ................. +300°C Case 2, H and X (soldering, 10 seconds)......... +260°C Storage temperature ................................ −65°C to +175°C Junction temperature (T_J) .......................... +175°C Power dissipation (P_D): 2/ Case P .......................................... 1274 mW Case 2 .......................................... 1800 mW Case H and X..................................... 725 mW Thermal resistance, junction-to-case (θ_JC): Case P.......................................... 14°C/W Case 2.......................................... 17°C/W Case H and X.................................... 18°C/W Thermal resistance, junction-to-ambient(θ_JA): Case P at 1 W................................... 118°C/W Case 2.......................................... 83°C/W Case H and X at 0.5 W........................... 207°C/W

Supply voltage range (V_CC).......................... +4.5 V dc to +5.5 V dc Ambient operating temperature range (T_A)............ −55°C to + 125°C Voltage at any bus terminal: (separately or common mode, V_I or V_CM).......... −7.0 V to +12 V dc Differential input voltage (V_ID).................... −7.0 V to +12 V dc Output current HIGH (I_OH): Driver.......................................... −60 mA Receiver........................................ −400 µA Output current LOW (I_OL) : Driver.......................................... 60 mA Receiver........................................ 16 mA

intended Use: