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DLA - SMD-5962-84064 REV C

MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 20 November 1992
Status: inactive
Page Count: 13
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit circuit 01 54HC147 10-to-4 line priority encoder

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, ¼" × ⅞"), dual-in-line package F F-5 (16-lead, ¼" × ⅜"), flat package 2 C-2 (20-terminal, .350" × .350"), square chip carrier package

Supply voltage range (VCC)- - - - - - - - - - - - −0.5 Vdc to +7.0 V dc DC input voltage- - - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc DC output voltage - - - - - - - - - - - - - - - - −0 5 V dc to VCC +0.5 V dc Clamp diode current - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - ±25 mA DC VCC or GND current (per pin) - - - - - - - - - ±50 mA Storage temperature range - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation, PD 2/ - - - - - - - - 500 mw Lead temperature (soldering 10 seconds) - - - - - 260°C Thermal resistance, Junction-to-case (θJC) Case outlines E, F, and 2 - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) - - - - - - - - - - - - 175°C

Supply voltage range (VCC)- - - - - - - - - - - - 2.0 V dc to +6.0 V dc Case operating temperature range- - - - - - - - - −55°C to +125°C Input rise or fall time: VCC = 2.0 V - - - - - - - - - - - - - - - - - - 0 to 1,000 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - 0 to 500 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - 0 to 400 ns

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

SMD 5962-84064
September 24, 2018
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD 5962-84064
August 25, 2011
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD-5962-84064 REV E
March 18, 2005
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD-5962-84064 REV D
October 19, 2001
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-84064 REV C
November 20, 1992
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODER, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". The...
SMD-5962-84064 REV B
February 3, 1988
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-84064 REV A
March 10, 1986
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-84064
November 27, 1984
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODER, MONOLITHIC SILICON
A description is not available for this item.
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References

This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
View Less
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