IPC-TM-650 2.6.7.3
Thermal Shock - Solder Mask
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| Organization: | IPC |
| Publication Date: | 1 July 2000 |
| Status: | active |
| Page Count: | 2 |
scope:
This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.
Document History
IPC-TM-650 2.6.7.3
July 1, 2000
Thermal Shock - Solder Mask
This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.