scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 UC1852 High power factor preregulator

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V_CC) (low impedance source)........... 30.0 V Supply current (I_CC) (high impedance source).......... 30.0 mA Peak output current (I_OUT)............................ ±1.0 A Output energy, capacitive load........................ 5.0 µJ Input voltage, ISNS................................... ±5.0 V Feedback input voltage (V_FB).......................... −0.3 V to +10.0 V COMPARATOR current (I_COMP)............................ ±10.0 mA I_SET current.......................................... −10.0 mA Power dissipation (P_D) at T_A = +25°C.................. 1.0 W Storage temperature................................... −65°C to + 150°C Lead temperature (soldering, 10 seconds).............. +300°C Junction temperature (T_J)............................. +185°C Thermal resistance, junction-to-case (Θ_JC)............ See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA)......... 160°C/W

Supply voltage (V_CC).................................. 24.0 V Ambient operating temperature range (T_A).............. −55°C to + 125°C

intended Use: