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IPC - TM-650 2.2.14.2

Solder Powder Particle Size Distribution - Optical Image Analyzer Method

active, Most Current
Organization: IPC
Publication Date: 1 January 1995
Status: active
Page Count: 2
scope:

This test method is designed to determine powder particle size distribution in creams by image analysis.

Document History

TM-650 2.2.14.2
January 1, 1995
Solder Powder Particle Size Distribution - Optical Image Analyzer Method
This test method is designed to determine powder particle size distribution in creams by image analysis.

References

This document is referenced by:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
This document is referenced by:
J-STD-005 CHINESE - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
A description is not available for this item.
This document is referenced by:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document is referenced by:
J-STD-005 JAPANESE - Requirements for Soldering Pastes
Published by IPC on September 1, 2018
A description is not available for this item.
This document is referenced by:
J-STD-006 CHINESE - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published by IPC on July 1, 2013
A description is not available for this item.
This document is referenced by:
J-STD-006 JAPANESE - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published by IPC on July 1, 2013
A description is not available for this item.
This document is referenced by:
MIL-PRF-55110 - PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
Published by NPFC on May 16, 2020
Scope. This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes...
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