scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 10E551 6-bit D-type register 02 100E551 6-bit D-type register, temperature compensated

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style Y See figure 1 28 Quad flat pack

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_EE) 2/ - - - - - - - - - - - - - −8.0 V dc to 0.0 V dc Input voltage range (V_IN) 2/ - - - - - - - - - - - - - - −6.0 V dc to 0.0 V dc Minimum input swing (V_PP) - - - - - - - - - - - - - - - - 0.150 V dc Output current (I_OUT): Continuous - - - - - - - - - - - - - - - - - - - - - - 50 mA Surge - - - - - - - - - - - - - - - - - - - - - - - - - 100 mA Storage temperature range - - - - - - - - - - - - - - - - −65°C to +165°C Lead temperature (soldering, 10 seconds) - - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - - - +165°C Maximum power dissipation (P_D): Device type 01 - - - - - - - - - - - - - - - - - - - - 426 mW Device type 02 - - - - - - - - - - - - - - - - - - - - 495 mW Thermal resistance, junction-to-case (Θ_JC) - - - - - - - 1.23°C/W

Supply voltage range (V_EE): 2/ Device type 01 - - - - - - - - - - - - - - - - - - - - −5.46 V dc to −4.94 V dc Device type 02 - - - - - - - - - - - - - - - - - - - - −5.46 V dc to −4.20 V dc Input voltage range (V_IN): 2/ Device type 01 - - - - - - - - - - - - - - - - - - - - −1.950 V dc to −0.660 V dc Device type 02 - - - - - - - - - - - - - - - - - - - - −1.810 V dc to −0.880 V dc Output voltage range (V_OUT): 2/ Device type 01 - - - - - - - - - - - - - - - - - - - - −1.972 V dc to −0.672 V dc Device type 02 - - - - - - - - - - - - - - - - - - - - −1.810 V dc to −0.880 V dc Input rise and fall times, 20% to 80% (t_r, t_f) - - - - - 500 ps maximum Case operating temperature range (T_C) - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - 3/ percent

intended Use: