scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 (see 6.6) 256 × 9-bit parallel FIFO 120 ns 02 (see 6.6) 256 × 9-bit parallel FIFO 80 ns 03 (see 6.6) 256 × 9-bit parallel FIFO 65 ns 04 (see 6.6) 256 × 9-bit parallel FIFO 50 ns 05 (see 6,6) 256 × 9-bit parallel FIFO 40 ns 06 (see 6.6) 256 × 9-bit parallel FIFO 30 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X D-15 (28-lead, 1.485" × .310" × .230"), dual-in-line package Y D-10 (28-lead, 1.490" × .610" × .232"), dual-in-line package Z F-11 (28-lead, .740" × .380" × .090"), flat package U C-12 (32-terminal, .560" × .458" × .120"), rectangular chip carrier package

Terminal voltage with respect to ground - - - - - - −0.5 V dc to +7.0 V dc DC output current - - - - - - - - - - - - - - - - - 50 mA Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - 1.0 W Lead temperature (soldering, 10 seconds) - - - - - - +260°C Thermal resistance, junction-to-case (θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - 30°C/W Cases Y, Z, and U - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - - +150°C 1/

Supply voltage range (V_CC) - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Minimum high level input voltage (V_IH) - - - - - - - 2.2 V dc Maximum low level input voltage (V_IL) - - - - - - - +0.8 V dc 2/ Case operating temperature range (T_C) - - - - - - - −55°C to +125°C

intended Use: