scope:

This series of European Specifications specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. This specification also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die. This part specifies the data format that may be used for the exchange of data which is covered by other parts of this specification as well as definitions of all parameters used according to the principles and methods of IEC 61360.