scope:

This drawing forms a part of a one part- one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked device shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 10E474L 1K × 4 ECL SRAM 7 ns 02 10E474L 1K × 4 ECL SRAM 5 ns

This device class designator shall be a single letter identifying the product assurance level (see 6.6 herein) as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outlines shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP5-T24 or CDIP6-T24 24 dual-in-line Y GQCC1-J28 28 J-leaded chip carrier Z See figure 1 24 flat pack

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_EE to V_CC) - - - - - - - −7.0 V dc to +0.5 V dc DC Input voltage range - - - - - - - - - - - - V_EE to +0.5 V dc Output current - - - - - - - - - - - - - - - - −50 mA Maximum power dissipation - - - - - - - - - - - 1.04 W Lead temperature (soldering, 10 seconds) - - - +260°C Thermal resistance, junction-to-case (θ_JC): Case outlines X and Y - - - - - - - - - - - - See MIL-STD-1835 Case outline Z - - - - - - - - - - - - - - - 20°C/W 2/ Junction temperature (T_J) - - - - - - - - - - - +175°C Storage temperature range - - - - - - - - - - - −65°C to +150°C Temperature under bias- - - - - - - - - - - - - −55°C to +125°C

Supply voltage (V_EE) - - - - - - - - - - - - - −5.46 V dc to −4.94 V dc Minimum high level input voltage (V_IH): T_A = +25°C - - - - - - - - - - - - - - - - - −1.130 V T_C = +125°C - - - - - - - - - - - - - - - - - −1.030 V T_C = −55°C - - - - - - - - - - - - - - - - - −1.260 V Maximum low-level input voltage (V_IL): T_A = +25°C - - - - - - - - - - - - - - - - - −1.475 V T_C = +125°C - - - - - - - - - - - - - - - - - −1.450 V T_C = −55°C - - - - - - - - - - - - - - - - - −1.540 V Case operating temperature range (T_C) - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - 3/ percent

intended Use: