DLA - SMD-5962-91672 REV A
MICROCIRCUIT, LINEAR, 5 V, POSITIVE, FIXED, STEP DOWN VOLTAGE REGULATOR, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 9 June 1995 |
| Status: | inactive |
| Page Count: | 17 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 1575-5 Fixed, step down voltage regulator 02 1575-5 High voltage, fixed, step down voltage regulator
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line X see figure 1 4 TO-3 can Y see figure 1 5 Flange mount
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Total supply voltage (VIN) : Device type 01 - - - - - - - - - - - - - - - - - - - - - 45 V Device type 02 - - - - - - - - - - - - - - - - - - - - - 63 V ON/OFF pin input voltage - - - - - - - - - - - - - - - - - −0.3 V ≤ V ≤ + VIN Output voltage to ground (steady state) - - - - - - - - - - −1 V Storage temperature range (TSTG) - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds)- - - - - - - - - - +260°C Junction temperature (TJ) - - - - - - - - - - - - - - - - - +150°C Maximum power dissipation (PD): Device type 01 - - - - - - - - - - - - - - - - - - - - - Internally limited Device type 02 - - - - - - - - - - - - - - - - - - - - - Internally limited Thermal resistance, junction-to-case (θ JC): Case outline E - - - - - - - - - - - - - - - - - - - - 1.7°C/W at 1 W Case outline X - - - - - - - - - - - - - - - - - - - - 3.3°C/W at 1 W Case outline Y - - - - - - - - - - - - - - - - - - - - 3.8°C/W at 1 W Thermal resistance, junction-to-ambient (θ JA): Case outline E - - - - - - - - - - - - - - - - - - - - 67°C/W at 0.5 W, no air flow 28°C/W at 0.5 W, 500 LFPM Case outline X - - - - - - - - - - - - - - - - - - - - 45°C/w at 0.5 W, no air flow 10°C/W at 0.5 W, 500 LFPM Case outline Y - - - - - - - - - - - - - - - - - - - - 68°C/W at 0.5 W, no air flow 16°C/W at 0.5 W, 500 LFPM
Input voltage range: Device type 01 - - - - - - - - - - - - - - - - - - - - 8 V to 40 V Device type 02 - - - - - - - - - - - - - - - - - - - - 8 V to 60 V Ambient operating temperature range (TA) - - - - - - - - - −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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