The epoxy embedding compounds are intended for use in encasing coils, capacitors and the like, or in assemblies of electrical components or for forming small structural details of an electrical insulating nature.

Composition 1 is used in applications where low viscosity is a special advantage.

Composition 2 is used in preference to Composition 1 when a lower cure shrinkage, a coefficient of thermal expansion closer to that of the ordinary metals, and a higher thermal conductivity are desired.

Composition 3 is used for the same applications as Composition 2 as their properties are identical, except for color.