ARMY - MIL-P-46067A
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
inactive
| Organization: | ARMY |
| Publication Date: | 1 March 1971 |
| Status: | inactive |
| Page Count: | 13 |
Document History
March 17, 2015
Plastic Embedding Compound, Epoxy Resin System
A description is not available for this item.
March 7, 2000
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
March 7, 2000
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
October 20, 1998
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
February 9, 1977
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
The epoxy embedding compounds are intended for use in encasing coils, capacitors and the like, or in assemblies of electrical components or for forming small structural details of an electrical...
MIL-P-46067A
March 1, 1971
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
August 20, 1965
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.
October 25, 1963
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM
A description is not available for this item.