scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 2K × 8-bit UVEPROM 50 ns 02 2K × 8-bit UVEPROM 55 ns 03 2K × 8-bit UVEPROM 35 ns 04 2K × 8-bit UVEPROM 45 ns 05 2K × 8-bit UVEPROM 25 ns

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCCI-N28 28 Rectangular leadless chip carrier

The lead finish shall be as specified in MIL-M 38510 finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) . . . . . . . . . . . . +4.5 V to +5.5 V Storage temperature range . . . . . . . . . . . . . −65°C to +150°C Voltages on any pin with respect to ground . . . . −0.6 V to +7.0 V V_PP with respect to ground . . . . . . . . . . . . −0.6 V to +14.0 V Power dissipation (P_D) . . . . . . . . . . . . . . 550 mW 3/ Lead temperature (soldering, 10 seconds) . . . . . +300°C Thermal resistance, junction-to-case (θ_JC) . . . . See MIL-STD-1835 Endurance . . . . . . . . . . . . . . . . . . . . . 50 cycles/byte, minimum Data retention . . . . . . . . . . . . . . . . . . 10 years, minimum

Case operating temperature range (T_C) . . . . . . −55°C to +125°C

intended Use: