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JEDEC JESD 22-B100

Physical Dimensions

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Organization: JEDEC
Publication Date: 1 June 2003
Status: active
Page Count: 8
scope:

The standard provides a method for determining whether the external physical dimensions of the device are in accordance with the applicable procurement document. This revision includes a change in details to be specified by the procurement document.

Document History

JEDEC JESD 22-B100
June 1, 2003
Physical Dimensions
The purpose of this test is to determine whether the external physical dimensions of the device, in all package configurations, are in accordance with the applicable procurement document. The...
JEDEC JESD 22-B100
June 1, 2003
Physical Dimensions
The standard provides a method for determining whether the external physical dimensions of the device are in accordance with the applicable procurement document. This revision includes a change in...
JEDEC JESD 22-B100
June 1, 2003
Physical Dimensions
A description is not available for this item.
JEDEC JESD 22-B100
April 1, 1990
Physical Dimensions
A description is not available for this item.

References

This document is referenced by:
IEC TS 62686-1 - Process management for avionics – Electronic components for aerospace, defence and high performance (ADHP) applications – Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
Published by IEC on April 1, 2020
This part of IEC 62686, which is a Technical Specification, defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete...
This document is referenced by:
BS PD IEC TS 62686-1 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
Published by BSI on April 30, 2020
A description is not available for this item.
This document is referenced by:
JEDEC JEP 70 - Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware
Published by JEDEC on October 1, 2013
This publication contains a listing and description of commonly used quality and reliability related publications applicable to the semiconductor industry. It is intended to be a reference aid in...
This document is referenced by:
IEC 62239-1 - Process management for avionics – Management plan – Part 1: Preparation and maintenance of an electronic components management plan
Published by IEC on September 1, 2018
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the...
This document is referenced by:
BS DD IEC TS 62239 - Process management for avionics Preparation of an electronic components management plan
Published by BSI on August 14, 2003
A description is not available for this item.
This document is referenced by:
JESD22-B101D - External Visual
Published by JEDEC on April 1, 2022
External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished packaged device. External visual is a noninvasive and nondestructive test....
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