scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 LT1241 Controlled, pulse width modulator 02 LT1242 Controlled, pulse width modulator 03 LT1243 Controlled, pulse width modulator 04 LT1244 Controlled, pulse width modulator 05 LT1245 Controlled, pulse width modulator

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_CC) . . . . . . . . . . . . . . . . . +25 V Output current (I_OUT . . . . . . . . . . . . . . . . . ±1 A 2/ Output energy (capacitor load per cycle). . . . . . . . 5 µJ Analog inputs (FB and I_SENSE pins) . . . . . . . . . . −0.3 V to +6 V Error amplifier output sink current . . . . . . . . . . 10 mA Power dissipation (P_D).(T_A ≤ +25°C) . . . . . . . . . . 1 W Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds). . . . . . . . +300°C Thermal resistance, junction-to-ambient (Θ_JA) . . . . . 100°C/W Thermal resistance, junction-to-case (Θ_JC). . . . . . . See MIL-STD-1835

Supply voltage (V_CC) . . . . . . . . . . . . . . . . . +15 V Input voltage (V_IN) . . . . . . . . . . . . . . . . . . 12 V to 25 V Ambient operating temperature range (T_A). . . . . . . . −55°C to +125°C

intended Use: