scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54AS1034 Hex drivers

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline C D-1 (14-lead, .785" × .310" × .200"), dual-in-line package D F-2 (20-lead, .390" × .260" × .085"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc minimum to +7.0 V dc maximum Input voltage range - - - - - - - - - - - - - - - - −1.2 V dc at −18 mA to +7.0 V dc Storage temperature - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - 192.5 mW 1/ Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - - +175°C

Supply voltage range (V_CC) - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (V_IH) - - - - - - - 2.0 V dc Maximum low level input voltage (V_IL) - - - - - - - 0.8 V dc Case operating temperature range (T_C) - - - - - - - −55°C to +125°C

intended Use: