DLA - SMD-5962-95666 REV A
MICROCIRCUIT, LINEAR, DUAL/QUAD, RAIL-TO-RAIL, LOW POWER, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 5 February 1996 |
| Status: | inactive |
| Page Count: | 12 |
scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function 01 TLV2252M Dual, rail-to-rail, low power, operational amplifiers 02 TLV2254M Quad, rail-to-rail, low power, operational amplifiers 03 TLV2252AM Dual, rail-to-rail, low power, operational amplifiers with enhanced VIO 04 TLV2254AM Quad, rail-to-rail, low power, operational amplifiers with enhanced VIO
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier
The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
Supply voltage (VDD) . . . . . . . . . . . . . . . . . . +8.0 V dc 2/ Differential input voltage (VID) . . . . . . . . . . . . ±VDD 3/ Input voltage range (VIN) . . . . . . . . . . . . . . . −VDD − 0.3 V to +VDD Input current, each input (IIN) . . . . . . . . . . . . +5 0 mA to −5.0 mA Output current (IOUT) . . . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current into +VDD . . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current out of −VDD . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Duration of short-circuit current at or below +25°C . . Unlimited 4/ Operating free-air temperature range (TA) . . . . . . . −55°C to +125°C Storage temperature range (TSTG) . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering 10 seconds) . . . . . . . . +260°C Thermal resistance, junction-to-case (θJC) . . . . . . . See MIL-STD-1835 Maximum junction temperature (TJ) . . . . . . . . . . . +150°C Maximum power dissipation (PD): 5/ Cases C and 2 . . . . . . . . . . . . . . . . . . . . 1375 mW Cases D and H . . . . . . . . . . . . . . . . . . . . 700 mW Case P . . . . . . . . . . . . . . . . . . . . . . . 1050 mW
Supply voltage (±VDD) . . . . . . . . . . . . . . . . . 2.7 V dc to 8.0 V dc Input voltage range (VIN) . . . . . . . . . . . . . . . −VDD to +VDD − 1.3 V Common-mode input voltage (VIC) . . . . . . . . . . . . −VDD to +VDD − 1.3 V Ambient operating temperature range (TA) . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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