scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RNA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 TLV2252M Dual, rail-to-rail, low power, operational amplifiers 02 TLV2254M Quad, rail-to-rail, low power, operational amplifiers

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN. class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1 - Tl4 or CDIP2-TI4 14 Dual-in-line D GDFP1 - FI4 or CDFP2-Fl4 14 Flat pack H GDFP1 - F10 or CDFP2-F10 10 Flat pack P GDIP1 - T8 or CDIP2-T8 8 Dual-in-line 2 CQCCl-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_DD) . . . . . . . . . . . . . . . . +8.0 V dc 2/ Differential input voltage (V_ID) . . . . . . . . . . ±V_DD 3/ Input voltage range (V_IN) . . . . . . . . . . . . . . −V_DD − 0.3 V to +V_DD Input current, each input (I_IN) . . . . . . . . . . . +5.0 mA to −5.0 mA Output current (I_OUT) . . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current into +V_DD . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current out of −V_DD . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Duration of short-circuit current at or below +25°C . . Unlimited 4/ Operating free-air temperature range (T_A) . . . . . . −55°C to +125° Storage temperature range (T_STG) . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering 10 seconds) . . . . . . . . +260°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . See MIL-STD-1835 Maximum junction temperature (T_J) . . . . . . . . . . . +150°C Maximum power dissipation (P_D): 5/ Cases C and 2 . . . . . . . . . . . . . . . . . . . . 1375 mW Cases D and H . . . . . . . . . . . . . . . . . . . . 700 mW Case P . . . . . . . . . . . . . . . . . . . . . . . 1050 mW

Supply voltage (±V_DD) . . . . . . . . . . . . . . . . 2.7 V dc to 8.0 V dc Input voltage range (V_IN) . . . . . . . . . . . . . . −V_DD to +V_DD − 1.3 V Common-mode input voltage (V_IC) . . . . . . . . . . . . −V_DD to +V_DD − 1.3 V Ambient operating temperature range (T_A) . . . . . . . −55°C to +125°C

intended Use: