JSA - JIS C 60068-2-58
Environmental testing - Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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| Organization: | JSA |
| Publication Date: | 25 March 2006 |
| Status: | inactive |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Brazing and soldering): | 25.160.50 |
| ICS Code (Environmental testing): | 19.040 |
Document History
March 23, 2020
Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Amendment 1)
A description is not available for this item.
December 20, 2016
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
JIS C 60068-2-58
March 25, 2006
Environmental testing - Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
March 20, 2002
Environmental testing - Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.