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JSA - JIS C 60068-2-58

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

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Organization: JSA
Publication Date: 20 December 2016
Status: active
ICS Code (Electronic component assemblies): 31.190
ICS Code (Brazing and soldering): 25.160.50
ICS Code (Environmental testing): 19.040

Document History

JIS C 60068-2-58
March 23, 2020
Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Amendment 1)
A description is not available for this item.
JIS C 60068-2-58
December 20, 2016
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
JIS C 60068-2-58
March 25, 2006
Environmental testing - Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
JIS C 60068-2-58
March 20, 2002
Environmental testing - Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.

References

This document references:
IEC 61190-1-1 - Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
Published by IEC on March 1, 2002
A description is not available for this item.
This document references:
IEC 61190-1-2 - Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by IEC on February 1, 2014
A description is not available for this item.
This document references:
IEC 61249-2-22 - Materials for printed boards and other interconnecting structures Part 2-22: Reinforced base materials clad and unclad Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
Published by IEC on January 1, 2005
A description is not available for this item.
This document references:
IEC 61249-2-35 - Materials for printed boards and other interconnecting structures – Part 2-35: Reinforced base materials, clad and unclad – Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copperclad for lead-free assembly
Published by IEC on November 1, 2008
A description is not available for this item.
This document is referenced by:
JIS C 60068-3-13 - Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
Published by JSA on February 20, 2018
A description is not available for this item.
This document is referenced by:
JIS C 4605 - AC load break switches for rated voltages above 1 kV up to and including 52 kV
Published by JSA on April 20, 2020
This Standard is applicable to three-phase, alternating current switches and switch-disconnectors (hereafter referred to as switches), for indoor and outdoor installations, for rated voltages above 1...
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