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JSA - JIS C 60068-3-13

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

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Organization: JSA
Publication Date: 20 February 2018
Status: active
ICS Code (Environmental testing): 19.040

Document History

JIS C 60068-3-13
February 20, 2018
Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
A description is not available for this item.

References

This document references:
JIS C 60068-2-69 - Environmental testing—Part 2-69: Tests—Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by JSA on March 20, 2019
This Standard outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time...
This document references:
IEC 61760-1 - Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by IEC on July 1, 2020
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set...
This document references:
JIS C 60068-2-20 - Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Published by JSA on May 20, 2010
A description is not available for this item.
This document references:
JIS C 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by JSA on December 20, 2016
A description is not available for this item.
This document references:
JIS C 60068-2-69 - Environmental testing—Part 2-69: Tests—Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by JSA on March 20, 2019
This Standard outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time...
This document references:
JIS C 60068-2-83 - Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Published by JSA on September 22, 2014
A description is not available for this item.
This document references:
JIS C 62137-3 - Electronics Assembly Technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Published by JSA on September 22, 2014
A description is not available for this item.
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