scope:

This Standard outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time and wettability)], the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations on electronic components and printed boards. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to the lands of components and printed boards with metallic terminations and metallized solder pads.

This document provides the measurement procedures for solder alloys both with and without lead (Pb).

NOTE The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows.

IEC 60068-2-69:2017 Environmental testing-Part 2-69: Tests-Test Te/Tc:Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standards and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.